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2016 Student Design Challenge Awards Luncheon Will You Be There?

PPA 2016 Luncheon Blog (1)
The Paperboard Packaging Alliance (PPA) is gearing up for the upcoming Student Design Challenge (SDC) Awards Luncheon. On Monday, November 7, more than 150 students, professors and paperboard packaging industry professionals will attend the luncheon held in conjunction with PACK EXPO Chicago. 

Luncheon participants will have the opportunity to vote for a “People's Choice Award,” be eligible for door prizes, receive a brochure featuring the 2016 SDC entries and be the first to hear about the 2017 Challenge.

Guest judges Jennifer Mitkal, packaging engineer of Barilla and John Rebhorn, senior principal packaging engineer of General Mills will present the 2016 awards and share their industry expertise with the luncheon attendees. The Barilla and General Mills brands can be found in your household and on a global scale!

Additionally, PPA judge Brett Wade, global segment manager and his colleague Mark Butryn, business manager of packaging for International Paper Company will be there. For more information about the judges, visit our “Meet the Judges” page.

Top packaging and graphic design schools will be attending including, Rochester Institute of Technology (RIT), Michigan State University and Virginia Tech, just to name a few. Will your school be there to participate in the school roll call? All packaging and graphic design schools are welcome. If you or your school would like to attend, please contact us at ppa@afandpa.org.

Be sure to check out pictures from last year’s (2015) SDC Awards Luncheon on our Facebook page!

We look forward to seeing you in Chicago as we recognize outstanding student teams from across the U.S. and Canada and celebrate their innovative paperboard packaging designs.

 

Happy Designing!

The PPA Staff